Comparing Chip Seal vs. Asphalt
Choosing the right materials can be key to the success of any project, including pavement installation. If you’re organizing a new construction project and have questions about your paving options, then keeping reading to learn about the differences between chip seal and asphalt .
Chip seal is an asphalt product that can be placed over existing pavement, and it is used to protect and extend the life of a paved surface, as well as repair cracks and prevent water damage. Chip sealing a surface involves the application of liquid asphalt, which is followed by crushed aggregate that is pressed down and embedded into the asphalt. There are 2 types of chip sealing, and the first type, called single chip sealing, is often used to protect existing pavement from damage and restore the surface of rough or cracked pavement. This option creates a waterproof asphalt layer and a skid-resistant surface. The second type, called double chip sealing, can be ideal for addressing roads that suffer from porousness, open texture, or severe cracking. This type of chip sealing involves 2 applications and can help stabilize pavement, control dust, and create a surface that is similar to pavement.
Asphalt, on the other hand, is something that you are probably accustomed to seeing each time you step outside, as it is used in the construction of many roads. Unlike chip seal, asphalt is a paving material, and it is a popular option due to its affordability. Asphalt, which is made of semi-solid petroleum, is applied in a hot, liquid form, which then solidifies after cooling. This material is less expensive than some other paving options, and it is also easy to maintain, resistant to stains, and repairable when it becomes cracked or worn down.
Cactus Asphalt is a professional, full-service paving company, and we specialize in both chip sealing and asphalt installation in Phoenix, AZ . If you’re interested in taking advantage of either of these services, then please call (623) 344-7675 to receive your free estimate.